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  • WHAT EXACTLY IS A REFLOW OVEN?

    REFLOW OVEN

    A reflow oven is a machine used to reflow solder surface-mount electronic components to printed circuit boards (PCBs).

    In high-volume commercial applications, reflow ovens take the form of a long tunnel with a conveyor belt that delivers PCBs.

    Commercial conveyorized reflow ovens include multiple independently heated zones that may be temperature controlled individually. As they move through the oven and each zone, PCBs are treated at a controlled rate.

    Technicians change the conveyor speed and zone temperatures to achieve a certain time and temperature profile. The profile utilized may change depending on the requirements of the PCBs being processed at the time.

     

    REFLOW OVEN TYPES


    Ovens with convection and infrared technology
    Infrared reflow ovens commonly use ceramic infrared heaters above and below the conveyor to supply heat to the PCBs via radiation.

    Convection ovens heat air in chambers, which is then utilized to convect and conduce heat to PCBs.

    They can be fan-assisted to control airflow within the oven. Because PCBs and components absorb infrared radiation differently, indirect heating with air provides more exact temperature control than direct heating with infrared radiation.

    Ovens that use both infrared radiative and convection heating are known as 'infrared convection' ovens.

    Some ovens are specifically designed to reflow PCBs in an oxygen-free atmosphere.

     

    The nitrogen <!--td {border: 1px solid #ccc;}br {mso-data-placement:same-cell;}-->best reflow oven takes a few minutes to reduce the oxygen concentration within the chamber to acceptable levels. As a result, nitrogen ovens frequently maintain the nitrogen infusion going at all times, lowering failure rates.

     

    Oven in the vapour phase
    Thermal energy generated by the phase change of a heat transfer liquid (e. g. PFPE) condensing on the PCBs is used to heat them. The liquid used is selected with the right boiling point for the solder alloy in mind.

    Some benefits of vapour phase soldering include:

    It has a high energy efficiency due to the high heat transfer coefficient of the vapour phase medium.
    Soldering is a non-oxygen procedure. There is no need for any protective gas (such as nitrogen), and there is no danger of the assembly overheating.
    The boiling point of the medium restricts the maximum temperature that the assembly may reach.

     

    PROFILING THERMAL


    Thermal profiling is the process of monitoring many locations on a circuit board to identify thermal excursion during the soldering process.

    In the electronics manufacturing industry, SPC (statistical process control) helps analyse whether the process is under control, as assessed against the reflow criteria defined by soldering technologies and component requirements.

     

     

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